Superheat sensor having external temperature sensor

ABSTRACT

A superheat sensor includes a housing, a pressure sensor mounted within the housing, and a processor. A fluid passageway connects the pressure sensor to a source of superheat fluid. An external temperature sensor is located outside the housing of the superheat sensor and is electrically connected to the processor. The external temperature sensor is also electronically connected to a component of a fluid system to which the superheat sensor is attached and is configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional patent application of U.S. Pat. No. 9,140,613 issued Sep. 22, 2015, which claims the benefit of U.S. Provisional Application No. 61/611,747 filed Mar. 16, 2012. The disclosures of both documents are incorporated herein by reference.

BACKGROUND

Various embodiments of a fluid sensor are described herein. In particular, the embodiments described herein relate to an improved superheat sensor.

There are many fluid system applications that require knowledge of a fluid's superheat in order to optimize the state of the fluid system. These systems include, but are not limited to, HVAC systems. Fluids that may be used within these systems include, but are not limited to, refrigerants.

As used herein, the term superheat is defined as the condition where the fluid, regardless of the system type, has excess energy relative to the fluid's boiling point. This excess energy may be measured as the number of degrees of temperature above the fluid's boiling point, or superheat.

Methods of measuring superheat are known. For example, U.S. Pat. No. 5,070,706 discloses a superheat sensor having a single coupling to a fluid channel carrying fluid through which superheat is being measured.

U.S. Pat. No. 5,820,262 discloses a refrigerant sensor for calculating a superheat value for refrigerant material. The sensor has an internal pressure sensor and an internal temperature sensor.

U.S. Patent Publication No. 2011/0192224 discloses a superheat sensor having a flexible wall that defines an interface between an inner cavity having a charge fluid therein and the flow channel in thermal contact with the fluid flowing therein. The flexible wall is adapted to conduct heat between the flow channel and the inner cavity.

U.S. Patent Publication No. 2011/0222576 discloses a method for calibrating a superheat sensor.

Typical superheat sensors do not provide automatic fluid-type detection, high sensitivity, and resolution under a wide range of pressures, store superheat and related parametric history, generate alarms, and provide a variety of industry standard reporting options.

Accordingly, there remains a need in the art for an improved sensor and method of identifying and measuring superheat in fluids, especially refrigerants in HVAC systems.

SUMMARY OF THE INVENTION

The present application describes various embodiments of a superheat sensor. One embodiment of the superheat sensor includes a housing, a pressure sensor mounted within the housing, and a processor. A fluid passageway connects the pressure sensor to a source of superheat fluid. An external temperature sensor is located outside the housing of the superheat sensor and is electrically connected to the processor. The external temperature sensor is also electronically connected to a component of a fluid system to which the superheat sensor is attached and is configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.

Various advantages of the invention will become apparent to those skilled in the art from the following detailed description, when read in view of the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first embodiment of the universal superheat sensor according to the invention.

FIG. 2 is a cross sectional view of the universal superheat sensor illustrated in FIG. 1.

FIG. 3 side elevational view of a second embodiment of the universal superheat sensor.

FIG. 4 is a cross sectional view of a third embodiment of the universal superheat sensor.

FIG. 5 is an exploded perspective view of a fourth embodiment of the universal superheat sensor.

DETAILED DESCRIPTION

The present invention will now be described with occasional reference to the specific embodiments of the invention. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for describing particular embodiments only and is not intended to be limiting of the invention. As used in the description of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth as used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless otherwise indicated, the numerical properties set forth in the specification and claims are approximations that may vary depending on the desired properties sought to be obtained in embodiments of the present invention. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical values, however, inherently contain certain errors necessarily resulting from errors found in their respective measurements.

As used in the description of the invention and the appended claims, the phrase “universal superheat sensor” is defined as a superheat sensor which contains all the necessary sensors, electronics, and intelligence to automatically detect multiple fluid types, such as refrigerants, without re-calibration, and report the superheat of the multiple common fluid types used in residential, industrial, and scientific applications.

The superheat sensor according to the invention is a single, self-contained, stand-alone device which contains all the necessary sensors, electronics, and intelligence to automatically detect the fluid type, such as refrigerant, and report the superheat of multiple common fluid types used in residential, industrial, and scientific applications. The superheat sensor according to the invention communicates this information in a cost effective way using industry standard reports. It stores this information in a local memory device for subsequent retrieval of historical data. Additional data storage may be provided, such as through removable memory cards, and via an off-board computer, such as a laptop computer. The superheat sensor according to the invention may also be configured to provide the user various alarms for conditions such as low pressure (fluid leakage), low and/or high superheat (indicators of system flooding and out-of-range system efficiency), excessive pressure (system overcharge or imminent hardware failure), temperature out of range, and like conditions.

Referring now to FIGS. 1 and 2, a first embodiment of the universal superheat sensor 10 includes a housing 12, a fluid inlet member 14, an integrated pressure and temperature sensor 16, a printed circuit board (PCB) 18, a superheat processor 20, a data-reporting or communication module 22, and an Input/Output (IO) module 24. It will be understood that in lieu of the PCB 18, alternative substrates may be used for mounting electronic components. For example, electronic components, including but not limited to those disclosed below, may be mounted on a substrate formed from a polymer, ceramic, metal, or other desired material.

The housing 12 is the enclosure for all or a portion of the components of the universal superheat sensor 10. The illustrated housing 12 is provides a hermetic or airtight sealed space within which the measurement of the fluid may occur. The illustrated housing 12 includes a body 26 having an opening 28 in which the fluid inlet member 14 is mounted, and a cover 30 having an opening 32 in which the IO module 24 is mounted. If desired, a seal (not shown) may be disposed between the body 26 and the cover 30.

The body 26 and the cover 30 of the housing 12 may have any other desired size and shape, and may be formed from any desired material, such as plastic, metal, or ceramic. Alternatively, the fluid inlet member 14 may be formed from any other desired material.

In the embodiment illustrated in FIG. 2, the fluid inlet member 14 is a brass core or fitting having a centrally formed fluid passageway 34. The fluid inlet member 14 connects the integrated pressure and temperature sensor 16 to the source of superheat fluid (not shown). The fluid inlet member 14 may be any type of fitting, such as a standard ¼ inch port. Any other desired type of fluid inlet member may also be used. Additionally, external adapters (not shown) may be attached to the fluid inlet member 14 to connect it to a variety of fluid fittings (not shown) of fluid systems, such as HVAC systems.

As shown in FIG. 2, the illustrated integrated pressure and temperature sensor 16 is mounted to the PCB 18 within the housing 12, and includes a wide-range pressure sensor portion 36 that converts fluid pressure to an electrical signal. The generated electrical signal may be subsequently used by the superheat processor 20. As used in the description of the invention and the appended claims, the phrase “wide-range pressure sensor” is defined as a pressure sensor that it will support common ranges of system pressures that occur in known refrigerant systems while maintaining accuracy. The pressure sensor portion 36 may be any type of pressure sensor; including silicon, piezo-ceramic, capacitive, and integrated hall-effect transducers, and any other device that produces an electrical analogue of pressure. In the illustrated embodiment, the pressure sensor portion 36 of the integrated pressure and temperature sensor 16 is a silicon transducer. As shown in FIG. 2, the integrated pressure and temperature sensor 16 is exposed directly to the pressurized superheat fluid via the fluid inlet member 14 for fast and accurate measurement.

The illustrated integrated pressure and temperature sensor 16 includes a temperature sensor portion 38 that converts temperature to an electrical signal. The generated electrical signal may be subsequently used by the superheat processor 20. The illustrated temperature sensor portion 38 is provided to measure the internal liquid refrigerant temperature, and is structured and configured to support a wide range of fluid system temperatures, such as temperatures within the range of from about −50 degrees C. to about +125 degrees C., while maintaining an acceptable accuracy for a specific application. In some applications, an acceptable accuracy may be +/−0.5 degrees C. In other applications, an acceptable accuracy may be a range smaller or larger than +/−0.5 degrees C. Alternatively, the temperature sensor portion 38 may support fluid system temperatures within the range of from about −25 degrees C. to about +150 degrees C. The temperature sensor portion 38 may be any type of temperature sensor, including a thermistor, a thermocouple, a resistive element etched onto a substrate, a diode, or any other device that produces an electrical analogue of temperature. Advantageously, the illustrated integrated pressure and temperature sensor 16 is relatively small and physically close to the fluid to maximize both response time and measurement accuracy. It will be understood that the temperature sensor and the pressure sensor may be separate sensors as described below.

The illustrated superheat processor 20 is mounted to the PCB 18 and is a high-resolution, high accuracy device that processes the input signals from the pressure and temperature sensor portions 36 and 38, respectively, of the integrated pressure and temperature sensor 16, detects the fluid type, calculates the superheat of the fluid, and provides an output that identifies the level of the calculated superheat. The superheat processor 20 may also be configured to provide other data, such as fluid temperature, fluid pressure, fluid type, historical data maintained in an onboard memory (such as alarm and on-off history), and other desired information. The superheat processor 20 may be configured as a high-resolution processor that is able to detect and process, with a single pressure sensor and a single temperature sensor, or with the illustrated integrated pressure and temperature sensor 16, the wide-range of system pressures and temperatures that may be encountered in the fluids of the fluid systems with which the universal superheat sensor 10 will be used, for example refrigerants of HVAC systems. Advantageously, the superheat processor 20 maintains a high level of accuracy through one-time calibration over the operating range of pressure and temperature input. Non-limiting examples of suitable superheat processors include microcontrollers, Field Programmable Arrays (FPGA), and Application Specific Integrated Circuits (ASIC) with embedded and/or off-board memory and peripherals.

The illustrated communication module 22 is mounted to the PCB 18 and is a configurable hardware module that provides industry-standard Modbus data over a hard-wired backbone, such as an RS485 hard-wired backbone, schematically illustrated at 40 in FIG. 2. If desired, the communication module 22 may provide Modbus data and other communication protocols over communications means, such as RS232, I2C, SPI, and 4-20 mA, Current Loop, USB 2.0, Bluetooth, an RF module, and wireless information to a cell-phone application. An internal antenna (not shown) may be provided to support the RF module. The illustrated communication module 22 is flexible enough to support other current and future communication protocols as they become available.

The illustrated IO module 24 is a physical hardware interface that accepts input power and reports data through the available hard-wired interfaces. Common target devices that may be connected to the universal superheat sensor 10 via the IO module 24 are schematically illustrated at 42 in FIG. 2, and include, but are not limited to: additional temperature sensors (such as the temperature sensor 44 illustrated in FIG. 3) industry standard controller modules, laptop and notebook computers, cell phones, and memory cards such as non-volatile memory cards.

As shown in FIG. 3, an external temperature sensor 44 may be connected to the IO module 24 via the backbone 40. Also, the external temperature sensor 44 may be positioned near various components of a refrigeration system, such as an evaporator outlet and a compressor to measure the evaporator core temperature, the discharge temperature, and the like. It will be understood that any desired number of external temperature sensors 44 may be connected to the IO module 24 to simultaneously measure the temperature internally and at multiple components or devices.

Advantageously, the superheat processor 20 may process the pressure and temperature inputs from the integrated pressure and temperature sensor 16 and the external temperature sensors 44, if provided. The superheat processor 20 is calibrated to detect and identify a plurality of fluid types. The superheat processor 20 further calculates the superheat of any of the plurality of fluid types with a high degree of resolution and accuracy. The superheat processor 20 may also determine error conditions and store superheat and related parametric and alarm data. The superheat processor 20 may then report the superheat of the fluid system to which the superheat sensor 10 is attached. The superheat processor 20 may also report additional data such as temperature, pressure, fluid type, on-time, alarms, operational history, and the like. Advantageously, the superheat processor 20 needs to be calibrated only one time, and may thereafter calculate superheat and perform any of the tasks described above for any of a plurality of fluid types.

Additionally, the embodiments of the universal superheat sensor 10, 60, 70, and 80 described herein allow real-time data to be presented to a user, such as a contractor.

Referring again to FIG. 3, a second embodiment of the universal superheat sensor is shown at 60. The illustrated universal superheat sensor 60 includes the housing 12, the fluid inlet member 14, the PCB 18, the superheat processor (not shown in FIG. 3), the communication module (not shown in FIG. 3), the IO module 24, an internal pressure sensor 62, and an external temperature sensor 44, as described above. As described above, any desired number of external temperature sensors 44 may be connected to the IO module 24 to simultaneously measure the temperature at multiple components or devices.

Referring now to FIG. 4, a third embodiment of the universal superheat sensor is shown at 70. The illustrated universal superheat sensor 70 includes the housing 12, the fluid inlet member 14, the PCB 18, the superheat processor (not shown in FIG. 4), the communication module (not shown in FIG. 4), the IO module 24, an internal pressure sensor 62, and an internal temperature sensor 72. As shown in FIG. 4, the internal temperature sensor 72 is mounted within the housing 12, but is not in contact with the superheat fluid. Rather, the internal temperature sensor 72 is adjacent to, but outside of the fluid passageway 34. It will be understood that any desired number of external temperature sensors 44 may also be connected to the IO module 24 to simultaneously measure the temperature internally and at multiple components or devices. In addition to one or more external temperature sensors 44, if desired, the universal superheat sensor 80 may also include one or more of the target devices 42 that may be connected to the IO module 24 of the universal superheat sensor 80 via the backbone 40, as described above.

Referring now to FIG. 5, a fourth embodiment of the universal superheat sensor is shown at 80. The illustrated universal superheat sensor 80 includes a housing 82, a fluid inlet member 84, the PCB 88, the superheat processor 90, the communication module 92, and the IO module 94. The universal superheat sensor 80 may include the integrated pressure and temperature sensor 16. Alternatively, the universal superheat sensor 80 may include an internal temperature sensor and an internal pressure sensor, neither of which are shown in FIG. 5, but both of which are described above. The illustrated housing 82 includes a body 100 having an opening (not shown) in which the fluid inlet member 84 is mounted, and a cover 102. A seal 104 may be disposed between the body 100 and the cover 102. If desired, the universal superheat sensor 70 may also include one or more external temperature sensors 44, as described above, and may further include one or more target devices 42 that may be connected to the IO module 24 of the universal superheat sensor 70 via the backbone 40, as described above.

The principle and mode of operation of this invention have been explained and illustrated in its preferred embodiment. However, it must be understood that this invention may be practiced otherwise than as specifically explained and illustrated without departing from its spirit or scope. 

What is claimed is:
 1. A superheat sensor comprising: a housing; a pressure sensor mounted within the housing; a fluid passageway connecting the pressure sensor to a source of superheat fluid; a processor; and an external temperature sensor located outside the housing of the superheat sensor and not in contact with the superheat fluid within the superheat sensor, the external temperature sensor electrically connected to the processor and electronically connected to a heat generating component of a fluid system to which the superheat sensor is attached and configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.
 2. The superheat sensor according to claim 1, further including a fluid inlet member having the fluid passageway formed therethrough, the fluid inlet member selectively connectable to a plurality of fluid systems.
 3. The superheat sensor according to claim 1, wherein the pressure sensor produces an electrical analogue of pressure.
 4. The superheat sensor according to claim 3, wherein the pressure sensor is one of a silicon, piezo-ceramic, capacitive, and integrated hall-effect transducer.
 5. The superheat sensor according to claim 2, further including a communication module attached to the housing and configured to transmit data to a target device to which the communication module is electrically connected.
 6. The superheat sensor according to claim 1, wherein the external temperature sensor produces an electrical analogue of temperature.
 7. The superheat sensor according to claim 6, wherein the temperature sensor is one of a thermistor, a thermocouple, a resistive element etched onto a substrate, and a diode.
 8. The superheat sensor according to claim 1, further including an Input/Output module connected to the processor, wherein the processor processes input signals from the pressure sensor and the temperature sensor, detects a fluid type, calculates a superheat of the fluid, provides an output through the Input/Output module to a computer operatively connected to the Input/Output module, and wherein the output identifies the level of the calculated superheat, provides fluid temperature, provides fluid pressure, provides fluid type, and provides historical data maintained in an onboard memory.
 9. The superheat sensor according to claim 1, further including an Input/Output (IO) module attached to the housing and configured to report data to a target device to which the IO module is electrically connected.
 10. The superheat sensor according to claim 9, wherein the target device is one of a temperature sensor, a controller module, a computer, a cell phone, and a memory card.
 11. A superheat sensor comprising: a housing; a pressure sensor mounted within the housing; a fluid passageway connecting the pressure sensor to a source of superheat fluid; a processor; and an external temperature sensor located outside the housing of the superheat sensor and electrically connected to the processor, the external temperature sensor electronically connected to a heat generating component of the fluid system to which the superheat sensor is attached and configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component. 